Super-resolution can make inspection images appear sharper without preserving the evidence needed to detect a defect. We study this failure mode with a benchmark that separates reconstruction from detection and evaluates both at a predeclared low false-positive rate. Ten end-to-end repetitions combine independently generated line/space and contact-hole images with model training, calibration, clean controls, weak defects, and a held-out defect morphology. Every reconstruction is scored by the same local residual detector, while direct and jointly trained detectors form a separate comparison track. Reconstruction fidelity and inspection utility diverge: the two learned reconstruction models attain the highest structural similarity yet detect fewer defect pixels than bicubic interpolation in every paired repetition. A direct DeepLabV3 detector reaches $0.1984\pm0.0385$ recall at $0.000174\pm0.000084$ false-positive rate and satisfies the held-out feasibility criterion in all ten repetitions. An illustrative joint model, DPU-WaferSR, passes independent clean calibration but exceeds the held-out limit in all ten repetitions, demonstrating that calibration success does not guarantee transfer. Weak-defect recall remains near zero for every feasible method. Applying the unchanged policies to 4,591 public Carinthia-S masks further reveals large method-dependent shifts on real SEM texture. These results support a simple conclusion: super-resolution for inspection should be judged by preserved task evidence and operating-point transfer, not reconstruction quality alone.
Surface scratch defects in semiconductor manufacturing pose significant challenges due to their irregular shapes, low contrast, and varying scales. Traditional inspection methods often struggle to detect such defects reliably, especially in complex imaging scenarios. While deep learning approaches based on Convolutional Neural Networks (CNNs) have improved accuracy, they often fail to capture fine-grained edge details. To address these limitations, we propose ScratNet, a novel end-to-end scratch segmentation framework that integrates a modified Swin Transformer backbone with a tailored decoder. The decoder incorporates a Multi-Scale Dilated Aggregation (MDA) module to capture both local and global context, a Stem Integration Module (SIM) to restore spatial detail, and a Precision Refinement (PR) branch that enhances boundary sharpness using anisotropic convolutions. Through this stage-adaptive feature aggregation and boundary-aware refinement, ScratNet achieves superior accuracy on thin and irregular defects. Extensive experiments demonstrate that ScratNet consistently outperforms existing methods, providing a scalable and robust solution for automated scratch inspection in high-precision manufacturing.
Yusuke Ohtsubo, Kota Dohi, Koichiro Yawata +2cs.AI
Precise parametric control over circuit geometry is essential for semiconductor inspection, yet obtaining sufficient real training data remains costly. Although generative models such as diffusion models and Generative Adversarial Networks (GANs) can augment training data, they cannot guarantee the nanometer-scale geometric accuracy required for metrology tasks. We propose a visual program synthesis framework in which a Vision-Language Model (VLM) converts inspection images into editable Domain-Specific Language (DSL) code describing circuit geometries, enabling controlled generation of training data with exact parameter manipulation. Because the VLM is trained solely on synthetic DSL-rendered data, a domain gap arises when processing real Scanning Electron Microscope (SEM) images. We bridge this gap with an input binarization strategy that strips SEM-specific texture and noise, letting the model focus on geometric structure. On the MIIC dataset, binarized inputs improve the mean Dice coefficient from 0.4393 to 0.5256 over the raw-input baseline, demonstrating that simple texture abstraction substantially mitigates the sim-to-real gap.