A Generative Approach for Improving Multi-Label Defect Classification in Photovoltaic Modules

This paper addresses the challenge of multi-label defect classification in electroluminescence (EL) images of photovoltaic (PV) cells. Training models on images where multiple defects co-occur creates learning ambiguity, making it difficult to disentangle visual features for specific defect types, a problem compounded by the scarcity of examples for individual classes. To tackle this, we introduce Generative Defect Isolation (GDI), utilizing the LaMa inpainting model with Fast Fourier Convolutions to remove selected defects and generate realistic, single-defect training samples. Extensive experiments on Vision Transformer (ViT-S, ViT-L) and EfficientNetV2-L architectures demonstrate that GDI significantly outperforms baselines. The performance gains are most pronounced in low-data scenarios; class-wise analysis shows substantial improvements, boosting the F1-Score for rare defect classes by up to 63.6%. Furthermore, GDI effectively resolves learning ambiguity from co-occurring defects, yielding a 26% reduction in such co-occurring classification errors. Our work establishes GDI as an effective method for maximizing the value of existing segmentation datasets and sets a new performance benchmark for multi-label classification in this domain.

RobustDefect-LLM: Explainable and Robustness-Aware Industrial Surface Defect Classification with Decision Support and AI-Assisted Reporting

This paper presents RobustDefect-LLM, an industrial surface-defect inspection framework integrating deep-learning classification, operator-facing visual evidence, confidence-aware decision support, controlled AI-assisted reporting, traceable storage, and mobile interaction in a unified quality-control workflow. Here, robustness-aware denotes explicit evaluation under controlled image degradation and confidence-aware review routing, not an intrinsic robustness guarantee. Four transfer-learning-based convolutional neural networks, ResNet50, EfficientNet-B0, DenseNet121, and MobileNetV3-Large, were evaluated on 1,799 images from the six-class NEU-DET dataset using fixed training, validation, and held-out in-domain test partitions. MobileNetV3-Large achieved the highest numerical test accuracy (99.26%) and macro F1-score (0.9926), with a bootstrap 95% accuracy CI of 0.9815-1.0000. An exact paired McNemar test found no significant difference from DenseNet121 (p = 1.000). The selected model averaged 0.060 s per CPU forward pass (16.66 FPS). Under combined synthetic degradation, accuracy fell to 87.78% at mild intensity and below 40% at stronger intensities, revealing sensitivity to severe image-quality deterioration. Grad-CAM supplied visual evidence, while predictions with confidence below 0.90 or a top-2 margin below 0.10 were routed to HUMAN REVIEW. This conservative policy provided 12.22% automatic coverage and 100% observed selective accuracy among 33 eligible cases (95% CI: 89.43%-100.00%), while routing both observed classification errors to review. Under nominal controlled conditions, all 100 generated reports passed deterministic consistency checks, with a mean latency of 1.66 s. Results support the feasibility of the integrated workflow while emphasizing the need for calibration, repeated evaluation, and real-world industrial validation.

Bridging Quantum Computing Paradigms toward Semiconductor Yield: A Controlled CV-versus-DV Comparison on Wafer-Map Defect Classification

Realizing quantum neural networks (QNNs) in industry requires knowing which quantum computing paradigm suits which task. Motivated by AI accelerators and high-bandwidth memory, where die stacking makes wafer-level defect screening central to yield, we study WM-811K wafer-map defect classification (eight classes), comparing the dominant paradigms, continuous-variable (CV) and discrete-variable (DV), under controlled conditions. To isolate the quantum circuit as the sole variable, a shared convolutional backbone (~4.3M parameters) feeds interchangeable heads (classical dense, CV-QNN, or DV-QNN) as the only structural difference; each quantum head is scaled over three sizes (3, 4, 8 qumodes/qubits). The CV head consistently outperforms the DV head: at four qumodes/qubits it reaches 79.7 +/- 1.8% accuracy versus 61.6 +/- 1.4%, a non-overlapping 18-point gap. The advantage is sharpest on the spatially localized Edge-Loc class, easily confused with Scratch, which CV recovers with recall 0.66 +/- 0.06 while DV fails at every size (<=0.05), showing the structured CV layer better captures fine spatial distinctions between defect types. Training curves show the DV limitation is a representational-capacity ceiling, not an optimization failure; at the Fock cutoff used here (d = 2) the CV advantage reflects two intrinsic properties, a structured, neural-network-analogue layer and continuous phase-space encoding, not Hilbert-space dimensionality. On IBM hardware, DV accuracy holds at shallow depth, degrading only at the deepest circuit. Both quantum heads remain below the classical baseline (85.0%), but the controlled setting isolates where a structured head already helps and, as noise and scale improve, which paradigm can deliver practical advantage.

Context-Aware Deep Learning for Defect Classification in Atomic-Resolution STEM

Artificial intelligence is rapidly advancing materials characterization, yet most applications in electron microscopy rely solely on image contrast, overlooking the chemical and experimental context that shapes image formation. This limitation makes defect classification inherently ambiguous, as similar contrasts can arise from different materials or imaging conditions. Here we develop a context-aware learning framework that integrates image-derived contrast with metadata describing composition, beam energy, and detector geometry. Using a systematically constructed dataset of ~55 million simulated patches spanning 576 cases across 96 doped monolayer transition-metal dichalcogenides, we show that conditioning on contextual variables transforms defect classification from an ill-posed image-only task into a well-posed, physically grounded problem. The framework achieves over 98% accuracy on simulations and near-human agreement on experimental data, with a 94% reduction in posterior entropy. By emphasizing contextual grounding over architectural complexity, this approach links experimental image contrast to the underlying chemical and imaging conditions, supporting physically grounded defect assignments and a general pathway toward multimodal AI models for autonomous materials characterization.